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Automated Optical Inspection (AOI 500)

AI-Based High-Speed, High-Precision Wafer Inspection System 

Automatically detects microscopic defects on semiconductor wafer surfaces
using high-precision optical inspection technology. It identifies various defects,
including scratches, particles, cracks, and pattern defects, through high-resolution imaging, while AI deep-learning algorithms precisely classify even the smallest
defects. Inline automated inspection enables 100% wafer inspection while
maximizing production efficiency.

  • Ultra-Fine Defect Detection (as small as 0.5 μm)
  • Non-Periodic Scan Technology (HyVISION Only)
  • Real-Time Processing Architecture
    (Distributed/Multi-Processing, Multi-Threading)
  • High-Resolution Telecentric Illumination

  • High-Performance LED Lighting 

  • AI Deep Learning Algorithms 
    (Wafer Teaching/Defect Detection/Defect Classification)

Key Features Technical

Built on our core capabilities and differentiated technologies,
we present the key features and technical strengths that deliver new value to our customers.

Automated Optical Inspection
Automated Optical Inspection Inspection Site Review Site

* Click a marker to explore each zone.

Main Features

1

Ultra-Fine Defect Detection

Provides high-resolution inspection technology that
precisely detects ultra-fine defects and external foreign
matter at the 0.5um level.
3

Automated Wafer Vision Teaching

Automates Wafer / Vision Teaching to reduce
operator dependency and shorten setup time.
5

High-Resolution Telecentric Illumination

Applies telecentric illumination to secure uniform light
distribution and distortion-free high-resolution images,
providing a precise inspection environment.

7
AI-Based Defect Detection & Classification
Combines rule-based algorithms with AI deep learning
to improve inspection accuracy and scalability.
2

Non-Periodic Scan Technology (HyVISION Only)

Supports both periodic and non-periodic scan methods to flexibly respond to various inspection conditions, enabling inspection of
fixed patterns as well as irregular environments.
4

Real-Time Processing Architecture

Real-time inspection system based on
distributed / multi-processing / multi-thread architecture.
6
High-Performance LED Lighting
Applies LEDs with +/-2% brightness deviation and up to
20,000 hours lifetime to improve image quality consistency
and maintenance efficiency, implementing an optimized
inspection environment through in-house light source technology.

Specifications 

Item

Specification

Description

Objective FOV @ Magnification

  11.0mm @ X2 

  4.40mm @ X5

  2.93mm @ X7.5

  2.20mm @ X10

  1.10mm @ X20

Supports up to optical changeable 
magnifications with an automated turret

Resolution @ Magnification

  2.75um @ X2 

  1.10um @ X5

  0.73um @ X7.5

  0.55um @ X10

  0.27um @ X20

Illumination Type

  Bright Field & Dark Filed

  Wide & Narrow Angle @ Dark Filed 

Illumination Source

  LED  

  Life Time (Max 20,000 hours)

Inspection Item

Semiconductor Wafer Inspection

Display Inspection 

Cover Glass Inspection 

   · Micro-Defect Detection (0.5μm)
   · Scratch · Particle · Pattern
   · Non Periodic Scan Inspection
   · AI Based Auto Defect Classification


    · High Speed Full Surface Inspection of Large Panels
    · Bright Spot · Dark Spot Detection
    · Micro Scratches · Foreign Particles
    · High Resolution Telecentric Illumination Applied

 · High Speed Surface Defect Detection on Tempered Glass

 · Crack · Chip · Edge Defect Inspection
 · Separate Detection of Internal/External Foreign Particles

 · Compatible with Various Sizes · Shapes

Application


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